Assessment of SMT solder paste printer

Taoqiongyao SMT movable metal web 2020-04-11 10:01:28

In SMT chip production process, solder paste printing is indispensable, and it's also the crucial element top quality station in SMT chip proofing system.

We provide construction system for digital work supervision.

one. Solder paste printing know-how

The presently built monitor board is employed, plus the display board is contacted along with the printed board, and also the solder paste is evenly rolled on the screen board and injected into the mesh by a specific way; in the event the screen board is demoulded, the solder paste falls off through the mesh to your pad as outlined by the shape on the mesh, thus completing the procedure of solder paste printing.

2. Automated solder paste printing device

Utilizing mechanical positioning and optical calibration procedure, it may possibly automatically align the posture of monitor board and PCB pad; when solder paste printing, the velocity and pressure of scraper can be set; the display screen board may be quickly cleaned to make certain the follow-up printing high-quality; the solder paste printing quality is secure; the automated solder paste printing tools is often offline stand-alone or on the web on the net.

three. Conveying procedure of solder paste printing equipment

Composition: together with conveying guide rail, motor, driving wheel, belt, cease plate sensing machine and track width changing system.

Function: adjust the position and width of PCB in PCB printing process to adapt to PCB Printing of various measurements.

four. Monitor plate positioning technique of solder paste printing device

The utility model includes a mesh plate moving machine plus a mesh plate repairing device;

Purpose: clamp, shift and correct the mesh plate.

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five. PCB positioning technique of solder paste printing equipment

Composition: such as vacuum platform, magnetic thimble and flexible PCB clamping system.

Functions: vacuum adsorption and magnetic thimble (movable) product can be certain the flatness of PCB with out warping; flexible PCB clamping device can clamp PCB of different sizes and thicknesses.

six. Eyesight process of solder paste printing machine

Composition: which include digicam, light-weight resource command process, display screen method and visible command software package.

Operate: up see and down view visual purpose to be sure speedy and exact identification and alignment of display screen board and PCB.

seven. Scraper method of solder paste printing equipment

Composition: like scraper clamping head and scraper push control.

Function: command the toughness and speed in the scraper to obtain the strain about the screen board, make the screen board and PCB close make contact with, and make the solder paste roll evenly to ensure the solder paste to the mould.

8. Screen cleaning gadget of solder paste printing device

Composition: which include vacuum cleaning product, cleaning fluid spraying machine, cleaning paper roll unit and cleaning operation lifting management system.

Function: comprehensive dry cleaning, wet cleaning and vacuum cleansing. It may possibly completely clear the residual solder paste while in the mesh and ensure the follow-up printing top quality.

nine. "Three ball law" of solder paste printing

1) Not less than 3 tin balls using the biggest diameter is usually organized vertically while in the thickness route from the mesh gap;

2) At the least 3 tin balls with all the most significant diameter could be arranged horizontally during the width route on the smallest hole while in the mesh plate.

10. Storage of solder paste

one) 3-7 refrigerated;

2) Return to place temperature for 1.5-2 several hours right before use. Don't open the duvet ahead of returning to home temperature to prevent dampness absorption.

eleven. Solder paste stirring

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Computerized mixing: unique mixers have various mixing time;

Manual mixing: mixing by unique person and regular procedure. Stir for 30 seconds, get some of the all-natural downward drip, on the beginning such as thick syrup drip, after the block fracture tumble improved, usually the viscosity is bad.

twelve. Printing parameters that PCB really should fulfill:

one) PCB flat, no warping;

2) The solder mask should not be higher compared to pad, making sure that the pad could be in fantastic make contact with with the mesh plate;

3) The printing pattern is during the middle;

four) Solder mask and display screen printing never have an effect on the pad.

5) Mark issue is a spherical, bare copper that has a diameter of one mm ?¨¤ 0.2 mm;

6) It really is arranged within an open up spot with no other wiring, display printing or pad around, so as to stay away from interference with machine identification;

seven) A minimum of 2 mark details shall be organized on just about every surface of PCB, which are positioned about the diagonal line of PCB, plus the distance shall be as far as feasible.

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